Applications of FEM for multiple laminated structure in electronic packaging

DOI10.1016/S0168-874X(98)00030-4zbMath0920.73355OpenAlexW2090543548MaRDI QIDQ1274174

Jiro Sakamoto, Juhachi Oda

Publication date: 12 January 1999

Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0168-874x(98)00030-4

zbMATH Keywords

basic IC modelelectronic printed board with solder bump jointsIC model with lead fingers

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Composite and mixture properties (74E30) Technical applications of optics and electromagnetic theory (78A55)

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