Mechanics of transonic debonding of a bimaterial interface: The anti- plane shear case
DOI10.1016/0022-5096(94)90072-8zbMATH Open0836.73058OpenAlexW1977737311MaRDI QIDQ1345995FDOQ1345995
Authors: Hong-Hui Yu, Wei Yang 
Publication date: 29 April 1996
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/0022-5096(94)90072-8
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analytical solutionstress singularityCauchy kernelenergy fluxhyperbolic regionwave speedmixed type equationselliptical regionWiener-Hopf type integral equationHilbert projection
Cites Work
Cited In (10)
- Intersonic crack growth in bimaterial interfaces: an investigation of crack face contact
- Dynamic behaviors of mode III interfacial crack under a constant loading rate
- Rapid Mode III Interface Flaw Extension: Dissimilar Anisotropic Solids with Largely Arbitrary Orientations of their Principal Material Axes
- Analytical solutions of dynamic mode I crack under the conditions of displacement boundary
- Supersonic crack growth in a solid of upturn stress--strain relation under anti-plane shear
- Shear dominated transonic interfacial crack growth in a bimaterial. II: Asymptotic fields and favorable velocity regimes
- A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface
- Mechanics of transonic debonding of a bimaterial interface: The in-plane case
- Analytical solutions to general anti-plane shear problems in finite elasticity
- Dynamic phenomena and crack propagation in dissimilar elastic lattices
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