Mechanics of transonic debonding of a bimaterial interface: The anti- plane shear case

DOI10.1016/0022-5096(94)90072-8MaRDI QIDQ1345995zbMATH OpenOpenAlexFDO

Authors Hong-Hui Yu, Wei Yang

Publication date 29 April 1996

Published in Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/0022-5096(94)90072-8

zbMATH Keywords

analytical solutionstress singularityCauchy kernelenergy fluxhyperbolic regionwave speedmixed type equationselliptical regionWiener-Hopf type integral equationHilbert projection

Mathematics Subject Classification ID

Fracture and damage (74R99)

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• Interface delamination of bi-material structure under dynamic time harmonic loading
• On the propagation of plane waves at a pure shear interface

Cites work

• Dynamic Fracture Mechanics
• Highly transient elastodynamic crack growth in a bimaterial interface: Higher order asymptotic analysis and optical experiments
• Mechanics of dynamic debonding

Cited in

(10)

• Dynamic behaviors of mode III interfacial crack under a constant loading rate
• Intersonic crack growth in bimaterial interfaces: an investigation of crack face contact
• Rapid Mode III Interface Flaw Extension: Dissimilar Anisotropic Solids with Largely Arbitrary Orientations of their Principal Material Axes
• Analytical solutions of dynamic mode I crack under the conditions of displacement boundary
• Supersonic crack growth in a solid of upturn stress--strain relation under anti-plane shear
• Shear dominated transonic interfacial crack growth in a bimaterial. II: Asymptotic fields and favorable velocity regimes
• A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface
• Mechanics of transonic debonding of a bimaterial interface: The in-plane case
• Analytical solutions to general anti-plane shear problems in finite elasticity
• Dynamic phenomena and crack propagation in dissimilar elastic lattices

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