Solid analysis of micron-sized thin structures with BEM for steady-state heat conduction
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Publication:1655154
DOI10.1016/j.enganabound.2016.07.005zbMath1403.80022OpenAlexW2490364957MaRDI QIDQ1655154
Hao-Sen Guo, Quan Jiang, Xia-Ting Feng, Jia-He Lv, Shao-Jun Li
Publication date: 9 August 2018
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2016.07.005
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Uses Software
Cites Work
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