Structural decomposition of thermo-elastic semigroups with rotational forces
From MaRDI portal
Publication:1961692
DOI10.1007/s002330010003zbMath0990.74034OpenAlexW2090208241MaRDI QIDQ1961692
Irena Lasiecka, Roberto Triggiani
Publication date: 19 August 2002
Published in: Semigroup Forum (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s002330010003
uniform exponential stabilityrotational forcesenergy spacestructural decompositionanalytic semicontinuous contraction semigrouplinear thermoelastic plate
Related Items
On the infinitesimal generator of an optimal state semigroup ⋮ Unnamed Item ⋮ Sharp regularity results for hyperbolic-dominated thermoelastic systems with point control ⋮ Stability properties of an abstract system with applications to linear thermoelastic plates ⋮ An abstract semigroup approach to the third‐order Moore–Gibson–Thompson partial differential equation arising in high‐intensity ultrasound: structural decomposition, spectral analysis, exponential stability ⋮ The critical case of clamped thermoelastic systems with interior point control: Optimal interior and boundary regularity results ⋮ Sharp regularity theory for elastic and thermoelastic Kirchhoff equations with free boundary conditions ⋮ The asymptotic behavior of the linear transmission problem in viscoelasticity ⋮ Regularity and stability for a plate model involving fractional rotational forces and damping ⋮ Can the average temperature stabilize a system of thermoelastic plates? ⋮ A Gevrey class semigroup for a thermoelastic plate model with a fractional Laplacian: between the Euler-Bernoulli and Kirchhoff models ⋮ Long-time behavior of quasilinear thermoelastic Kirchhoff-Love plates with second sound ⋮ A trace regularity result for thermoelastic equations with application to optimal boundary control ⋮ Simultaneous exact/approximate boundary controllability of thermo-elastic plates with variable thermal coefficient and moment control ⋮ Asymptotic behaviour of nonlinear structural acoustic interactions with thermal effects on the interface