A unified solution for heat conduction in thin films
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Publication:1973247
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Cited in
(15)- An overview of advances in heat conduction models and approaches for prediction of thermal conductivity in thin dielectric films
- Unified solutions of heat diffusion in a finite region involving a surface film of finite heat capacity
- ``Eigen-periodic-in-space surface heating in conduction with application to conductivity measurement of thin films
- Solving macroscopic and microscopic pin-fin heat sink problems by adapted spectral method
- Hard-coupled model of local direct resistance heating of thin sheets
- Universal transmission conditions for thin reactive heat-conducting interphases
- Hybrid pseudospectral–finite difference method for solving a 3D heat conduction equation in a submicroscale thin film
- A novel electron-phonon coupling thermoelasticity with Burgers electronic heat transfer
- On efficient asymptotic modelling of thin films on thermally conductive substrates
- A mixed collocation-finite difference method for 3D microscopic heat transport problems
- New insights on microscale transient thermoelastic responses for metals with electron-lattice coupling mechanism
- Microscale Thermal Energy Transfer Over a Combined System of Thin Films: Analytical Approach
- Thermal Disturbance of Thin Films Pair: Cross-Plane Thermal Energy Transfer
- Wave propagation model of heat conduction and group speed
- Exact analytic solution and investigation of the Guyer-Krumhansl heat equation
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