Heating process analysis for microplate subjected to moving laser pulse source
DOI10.1016/J.EUROMECHSOL.2022.104802zbMATH Open1504.74014OpenAlexW4295808775MaRDI QIDQ2102580FDOQ2102580
Authors: Hu Liu, Jingxuan Ma
Publication date: 29 November 2022
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2022.104802
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finite element methodHamilton principledual-phase-lag modelthermo-mechanical couplingGreen function methodthree-dimensional heat conduction
Thermal effects in solid mechanics (74F05) Plates (74K20) Micromechanics of solids (74M25) Finite element methods applied to problems in solid mechanics (74S05)
Cites Work
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Cited In (5)
- Vibration characteristics of sandwich microshells with porous functionally graded face sheets
- Analysis of heat transfer in the rapid thermal processing of the plasma display panel
- A novel electron-phonon coupling thermoelasticity with Burgers electronic heat transfer
- Vibrations of microscale circular plates induced by ultra-fast lasers
- Three-dimensional analysis of thermoelastic damping in couple stress-based rectangular plates with nonlocal dual-phase-lag heat conduction
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