Interfacial behavior of thin film bonded to plastically graded substrate under tensile loading

DOI10.1016/J.EUROMECHSOL.2022.104818MaRDI QIDQ2102604zbMATH OpenOpenAlexFDO

Authors Wang Guo, Peijian Chen, Hao Liu, Guangjian Peng, Yufei Wu, Jiaming Zhu

Publication date 29 November 2022

Published in European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.euromechsol.2022.104818

zbMATH Keywords

finite element methodinterfacial damagevon Mises yield criteriondimension analysisinterfacial stressisotropical power-law hardeningplastic deformation energy

Mathematics Subject Classification ID

Thin films (74K35) Anelastic fracture and damage (74R20) Finite element methods applied to problems in solid mechanics (74S05) Small-strain, rate-independent theories of plasticity (including rigid-plastic and elasto-plastic materials) (74C05)

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Cites work

• Beam theory models for thin film segments cohesively bonded to an elastic half space
• Constraint effects in adhesive joint fracture
• Determination of constitutive response of plastically graded materials
• Indentation of plastically graded substrates by sharp indentors
• Mechanics of adhesive contact on a power-law graded elastic half-space
• Notch tip fields in amorphous films resting on ductile substrates

Cited in

(4)

• Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
• Modelling of the interface between a thin film and a substrate within a strain gradient plasticity framework
• Finite deformation behavior of a soft polymer coating adhering to titanium alloy (TI6AL4V)
• Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

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