Interfacial behavior of thin film bonded to plastically graded substrate under tensile loading

DOI10.1016/J.EUROMECHSOL.2022.104818zbMATH Open1504.74057OpenAlexW4304080743MaRDI QIDQ2102604FDOQ2102604

Peijian Chen, Yufei Wu, Jiaming Zhu, Wang Guo, Hao Liu, Guangjian Peng

Publication date: 29 November 2022

Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.euromechsol.2022.104818

zbMATH Keywords

finite element methodinterfacial damagevon Mises yield criteriondimension analysisinterfacial stressisotropical power-law hardeningplastic deformation energy

Mathematics Subject Classification ID

Thin films (74K35) Anelastic fracture and damage (74R20) Finite element methods applied to problems in solid mechanics (74S05) Small-strain, rate-independent theories of plasticity (including rigid-plastic and elasto-plastic materials) (74C05)

Cites Work

• Indentation of plastically graded substrates by sharp indentors
• Determination of constitutive response of plastically graded materials
• Beam theory models for thin film segments cohesively bonded to an elastic half space
• Constraint effects in adhesive joint fracture
• Mechanics of adhesive contact on a power-law graded elastic half-space
• Notch tip fields in amorphous films resting on ductile substrates

Cited In (1)

• Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

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