Frictional moving contact problem between a conducting rigid cylindrical punch and a functionally graded piezoelectric layered half plane
From MaRDI portal
Publication:2119933
DOI10.1007/s11012-021-01407-2zbMath1483.74071OpenAlexW3189789966MaRDI QIDQ2119933
Publication date: 31 March 2022
Published in: Meccanica (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s11012-021-01407-2
singular integral equationfunctionally graded piezoelectric materials (FGPMs)moving punchconducting punchmoving contact problem
Related Items (1)
Cites Work
- Unnamed Item
- Unnamed Item
- Frictional contact of anisotropic piezoelectric materials indented by flat and semi-parabolic stamps
- A circular indenter on a piezoelectric layer
- Electromechanical behaviour of a finite piezoelectric layer under a flat punch
- Sliding frictional contact analysis of functionally graded piezoelectric layered half-plane
- Contact problems. The legacy of L. A. Galin. Edited by G. M. L. Gladwell
- Dynamic punch problems in an orthotropic elastic half-plane
- Electro-mechanical sliding frictional contact of a piezoelectric half-plane under a rigid conducting punch
- The contact problem of a circular rigid punch on piezomagnetic materials
- On the use of the interpolation polynomial for solutions of singular integral equations
- The study of dynamic behavior of functionally graded piezoelectric materials and an application to a contact problem
This page was built for publication: Frictional moving contact problem between a conducting rigid cylindrical punch and a functionally graded piezoelectric layered half plane