Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction

DOI10.1016/j.apm.2020.09.005zbMath1481.74035OpenAlexW3089231534MaRDI QIDQ2245879

Hong-Shuang Li, Wujiu Pan, Minghai Wang, Lin-Lin Wang

Publication date: 15 November 2021

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2020.09.005

zbMATH Keywords

thermoelasticthree-dimensional heat conductiondamping modelingKirchhoff-Love microplate

Mathematics Subject Classification ID

Plates (74K20) Thermodynamics in solid mechanics (74A15)

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Cites Work

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