Hypersingular integral equation based micromechanical models for a microscopically damaged antiplane interface between a thin elastic layer and an elastic half space

DOI10.1016/J.APM.2015.02.002MaRDI QIDQ2285356zbMATH OpenOpenAlexFDO

Authors W. T. Ang, Xue Wang, H. Fan

Publication date 8 January 2020

Published in Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.apm.2015.02.002

zbMATH Keywords

thin filmmicromechanicshypersingular integral equationseffective stiffnessmicroscopically damaged interface

Mathematics Subject Classification ID

Micromechanical theories (74A60) Mathematical modeling or simulation for problems pertaining to mechanics of deformable solids (74-10)

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Cites work

• scientific article; zbMATH DE number 3787272 (Why is no real title available?)
• Green's function in plane anisotropic bimaterials with imperfect interface
• Hypersingular integral equations in fracture analysis
• Interaction between a screw dislocation and viscoelastic interfaces
• Micro-mechanics models for an imperfect interface under anti-plane shear load: hypersingular integral formulations
• On the solution of integral equations with strongly singular kernels
• The method of fundamental solutions for heat conduction in layered materials

Cited in

(4)

• A micromechanical model based on hypersingular integro-differential equations for analyzing micro-crazed interfaces between dissimilar elastic materials
• Hypersingular integral and integro-differential micromechanical models for an imperfect interface between a thin orthotropic layer and an orthotropic half-space under inplane elastostatic deformations
• Micro-mechanics models for an imperfect interface under anti-plane shear load: hypersingular integral formulations
• Micro-statistical modeling of an imperfect interface in a piezoelectric bimaterial under inplane static deformations

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