Hypersingular integral equation based micromechanical models for a microscopically damaged antiplane interface between a thin elastic layer and an elastic half space
DOI10.1016/J.APM.2015.02.002zbMATH Open1443.74123OpenAlexW1975748292MaRDI QIDQ2285356FDOQ2285356
Authors: W. T. Ang, Xue Wang, H. Fan 
Publication date: 8 January 2020
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2015.02.002
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thin filmmicromechanicshypersingular integral equationseffective stiffnessmicroscopically damaged interface
Micromechanical theories (74A60) Mathematical modeling or simulation for problems pertaining to mechanics of deformable solids (74-10)
Cites Work
- Hypersingular integral equations in fracture analysis
- On the solution of integral equations with strongly singular kernels
- Title not available (Why is that?)
- The method of fundamental solutions for heat conduction in layered materials
- Green's function in plane anisotropic bimaterials with imperfect interface
- Interaction between a screw dislocation and viscoelastic interfaces
- Micro-mechanics models for an imperfect interface under anti-plane shear load: hypersingular integral formulations
Cited In (4)
- Micro-statistical modeling of an imperfect interface in a piezoelectric bimaterial under inplane static deformations
- A micromechanical model based on hypersingular integro-differential equations for analyzing micro-crazed interfaces between dissimilar elastic materials
- Hypersingular integral and integro-differential micromechanical models for an imperfect interface between a thin orthotropic layer and an orthotropic half-space under inplane elastostatic deformations
- Micro-mechanics models for an imperfect interface under anti-plane shear load: hypersingular integral formulations
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