Thermal-stress reduction for a Czochralski-grown single crystal
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Publication:2385465
DOI10.1007/s10665-006-9117-3zbMath1120.74043MaRDI QIDQ2385465
Shuqing Liang, Hua-xiong Huang
Publication date: 12 October 2007
Published in: Journal of Engineering Mathematics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10665-006-9117-3
74M05: Control, switches and devices (``smart materials) in solid mechanics
74F05: Thermal effects in solid mechanics
74P10: Optimization of other properties in solid mechanics
80M50: Optimization problems in thermodynamics and heat transfer
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Cites Work
- The cooling of low-heat-resistance cylinders by radiation
- Optimization of the crystal surface temperature distribution in the single-crystal growth process by the Czochralski method
- A Semianalytical Thermal Stress Model for the Czochralski Growth of Type III-V Compounds
- A mathematical model of the edge-defined film-fed growth process