Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?

DOI10.1007/S00419-005-0394-5zbMATH Open1158.74439OpenAlexW2062998917MaRDI QIDQ2432398FDOQ2432398

Authors: H.-J. Albrecht, T. Hannach, A. Häse, A. Juritza, Klaus-Robert Müller, Wolfgang H. Müller 

Publication date: 25 October 2006

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-005-0394-5

Recommendations

• Determining material parameter of solder alloys by nanoindentation
• Determination of mechanical properties by instrumented indentation
• Determination of material properties using nanoindentation and multiple indenter tips
• A mechanics prediction of the behaviour of mono-crystalline silicon under nano-indentation.
• Influence of Vickers tip imperfection on depth sensing indentation tests

Mathematics Subject Classification ID

Phase transformations in solids (74N99)

Cites Work

• Investigation of model parameters of lead-containing and lead-free solders

Cited In (10)

• Continuous stiffness measurements of layered materials used in magnetic storage devices
• Gripless nanotension test for determination of nano-scale properties
• Identification of material models of nanocoatings system using the metamodeling approach
• Estimation of FeB layer's yield strength by comparison of finite element modeling with experimental data
• Determining material parameter of solder alloys by nanoindentation
• Recovery of information on the depth-dependent profile of elastic FGMs from indentation experiments
• Contact stiffness indentation tomography: moduli-perturbation approach
• Simulation for measurements of electric properties of surface nanostructures
• On the Size Effects in Indentation Testing of Elastic Functionally-graded Materials
• Local mechanical properties of the 6061-T6 aluminium weld using micro-traction and instrumented indentation

This page was built for publication: Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2432398)