Modelling and simulation of adhesive curing processes in bonded piezo metal composites

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Publication:2512519


DOI10.1007/s00466-014-1005-5zbMath1398.74006arXiv1310.8264OpenAlexW3104795205MaRDI QIDQ2512519

Robert Scherzer, J. Ihlemann, R. Landgraf, Martin Rudolph

Publication date: 7 August 2014

Published in: Computational Mechanics (Search for Journal in Brave)

Full work available at URL: https://arxiv.org/abs/1310.8264



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