Stress singularities at interface corners in bonded dissimilar isotropic elastic materials

From MaRDI portal
Publication:2552398

DOI10.1016/0020-7683(71)90077-1zbMath0236.73020OpenAlexW2047548329MaRDI QIDQ2552398

Yanyan Li

Publication date: 1971

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/0020-7683(71)90077-1



Related Items

Defect detection using Cauchy data on a part of outer boundary of an elastic body, Numerical analysis of stress singularity at singular points of three-dimensional elastic bodies, Asymptotic fields near an interface corner in orthotropic bi-materials, A generalized screw dislocation near a wedge-shaped magnetoelectroelastic bi-material interface, On the stress singularities in the plane elasticity of the composite wedge, Analysis of the stress singularity field at a vertex in 3D-bonded structures having a slanted side surface, Numerical and applied results of the analysis of singular solutions for a closed wedge consisting of two dissimilar materials, On the singular behavior at the vertex of a bi-material wedge, Singular boundary elements for three-dimensional elasticity problems, Boundary element analysis of inclusions with corners, On stress singularities at angular corners of plates of arbitrary thickness under tension, Singular thermal residual stress field near the interface corner of bonded dissimilar materials, The anti-plane shear elasto-static fields near a crack terminating at an isotropic hyperelastic bi-material interface, On the influence of adhesive stress-separation laws on elastic stress singularities, Stress and displacement singularities near corners, The coupling of elastic, surface-wave modes by a slow, interfacial inclusion, A mathematical analogy and a unified asymptotic formulation for singular elastic and electromagnetic fields at multimaterial wedges, Mechanical behavior of a fiber end in short fiber reinforced composites, Singular, hypersingular and singular free electromagnetic fields at wedge tips in metamaterials, Singular Stress Behavior in a Bonded Hereditarily-Elastic Aging Wedge. Part I: Problem Statement and Degenerate Case, Partition of unity finite element for analysis of contact interface stress singularity, A crack emanating from the tip of bonded dissimilar materials, Application of bimaterial interface corner failure mechanics to silicon/glass anodic bonds, An asymptotic approach to crack initiation in fretting fatigue of complete contacts