Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives

DOI10.1007/s12046-009-0046-5zbMath1272.76035MaRDI QIDQ2655570

Yanyan Li

Publication date: 25 January 2010

Published in: Sādhanā (Search for Journal in Brave)

Full work available at URL: https://www.ias.ac.in/describe/article/sadh/034/05/0799-0810

zbMATH Keywords

rheology; wall-slip; isotropic conductive adhesives; solder paste; stencil printing process

Mathematics Subject Classification ID

76A99: Foundations, constitutive equations, rheology, hydrodynamical models of non-fluid phenomena