Transient response of an annular interfacial crack between dissimilar piezoelectric layers under mechanical and electrical impacts

DOI10.1002/ZAMM.201100043MaRDI QIDQ2897199zbMATH OpenOpenAlexFDO

Authors J. H. Ren, W. Wang, Y. S. Li, Z. Y. Cai

Publication date 9 July 2012

Published in ZAMM. Zeitschrift für Angewandte Mathematik und Mechanik (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1002/zamm.201100043

zbMATH Keywords

Cauchy singular integral equationsdynamic energy release ratedynamic field intensity factors

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35) Brittle fracture (74R10)

Recommendations

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Cites work

• Axially poled solid cylinder under tension with a flat annular crack
• Conducting cracks in a piezoelectric ceramic of limited electrical polarization
• Crack Extension Force in a Piezoelectric Material
• Crack tip shielding and anti-shielding effects of the imperfect interface in a layered piezoelectric sensor
• Dynamic crack propagation in piezoelectric materials. I: Electrode solution.
• Dynamic crack propagation in piezoelectric materials. II: Vacuum solution.
• Dynamic interfacial crack propagation in elastic-piezoelectric bi-materials subjected to uniformly distributed loading
• Effects of electric field on crack growth for a penny-shaped dielectric crack in a piezoelectric layer
• Electroelastic response of a flat annular crack in a piezoelectric fiber surrounded by an elastic medium
• Fracture mechanics for a mode III crack in a piezoelectric material
• Fracture mechanics for piezoelectric ceramics
• Fracture parameters of a penny-shaped crack at the interface of a piezoelectric bi-material system
• Numerical Inversion of the Laplace Transform by Use of Jacobi Polynomials
• On the dynamic behaviour of interfacial cracks between a piezoelectric layer and an elastic substrate
• On the fracture mechanics of piezoelectric solids
• Transient analysis of a mode-III crack propagating in a piezoelectric medium
• Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts
• Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts
• Two parallel penny-shaped or annular cracks in a functionally graded piezoelectric strip under electric loading

Cited in

(15)

• Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts
• Transient response of a crack in piezoelectric strip subjected to the mechanical and electrical impacts: Mode-III problem
• The transient response of a piezoelectric strip with a vertical crack under electromechanical impact load
• Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts
• Impact response of an interface crack in a hybrid piezoelectric laminate
• The transient response of bonded piezoelectric and elastic half-space with multiple interfacial collinear cracks
• Transient response of dissimilar piezoelectric layers with multiple interacting interface cracks
• Transient response of an insulating crack near to the interface between two piezoelectric half-planes under electromechanical impacts by BEM
• Dynamic fracture analysis of an annular interfacial crack between dissimilar magnetoelectroelastic layers
• A crack in a piezoelectric layer bonded to a dissimilar elastic layer under transient load
• Dynamic stress intensity factors of an interfacial crack in orthotropic elastic strips under impact loading conditions
• Transient response of two collinear dielectric cracks in a piezoelectric solid under inplane impacts
• Electro-mechanical coupling analysis of three-dimensional embedded braided composite piezoelectric vibration energy harvester
• Dynamic mode III stress intensity factors of multiple axisymmetric interfacial cracks in an FGM coated orthotropic layer
• Propagation of a mode-III interfacial conductive crack along a conductive interface between two piezoelectric materials

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