Analysis of a Crack in a Thin Adhesive Layer between Orthotropic Materials: An Application to Composite Interlaminar Fracture Toughness Test
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Publication:3112858
DOI10.3970/CMES.2010.058.247zbMath1231.74086OpenAlexW180522871MaRDI QIDQ3112858
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Publication date: 6 February 2012
Full work available at URL: https://idus.us.es/handle/11441/72026
compositescrackdelaminationimperfect interfaceBEMweak interfaceadhesive layerDCBspring boundary condition
Related Items (5)
BEM solution of delamination problems using an interface damage and plasticity model ⋮ BEM analysis of crack onset and propagation along fiber-matrix interface under transverse tension using a linear elastic-brittle interface model ⋮ A Mixed Finite Element-Based Numerical Method for Elastodynamics Considering Adhesive Interface Damage for Dynamic Fracture ⋮ Stress-driven local-solution approach to quasistatic brittle delamination ⋮ Two adhesive-contact models for quasistatic mixed-mode delamination problems
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