Thermoelastic stress analysis of multilayered films in a micro-thermoelectric cooling device

DOI10.1007/S10409-012-0207-3zbMATH Open1345.74033OpenAlexW1978903200MaRDI QIDQ315439FDOQ315439

Authors: Yu-Mei Yang, Xingzhe Wang, Wenjie Zhang 

Publication date: 21 September 2016

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-012-0207-3

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zbMATH Keywords

analytical solutionmultilayered thin-filmthermoelastic stressthermoelectric cooling device

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Thin films (74K35)

Cites Work

• The influence of the Thomson effect on the performance of a thermoelectric cooler
• Thermal stress analysis of multi-layer thin films and coatings by an advanced boundary element method

Cited In (4)

• Electronic thermal transport and thermionic cooling in semiconductor multi-quantum-well structures
• An Approximate Analysis of Stresses in Multilayered Elastic Thin Films
• Research on the buckling behavior of thermoelectric films on infinite elastic substrates
• Optimization of supercooling effect in nanoscaled thermoelectric layers

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