Recent advances in modeling and simulation of high-speed interconnects
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Publication:3365865
zbMATH Open1082.78014MaRDI QIDQ3365865FDOQ3365865
Authors: Ram Achar, Michel Nakhla 
Publication date: 13 February 2006
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- Interconnects in VLSI design
- Characteristics of on-chip dipole antenna using diamond for intra-chip wireless interconnect
- Passivity-preserving interpolation-based parameterized model order reduction of PEEC models based on scattered grids
- Efficient transient simulation of interconnect networks
- Wide-band modelling of CMOS interconnections and voiding damages with the lumped element LE-FDTD method
- Accelerating test, validation and debug of high speed serial interfaces
- Nonlinear model order reduction based on tensor Kronecker product expansion with Arnoldi process
- A unified approach for the analysis of networks composed of transmission lines and lumped circuits
- Macromodeling of high-speed interconnects by positive interpolation of vertical segments
- Fast and Efficient Methods for Circuit-based Automotive EMC Simulation
- A Green's function-based method for the transient analysis of plane waves obliquely incident on lossy and dispersive planar layers
- Partial element equivalent circuit(PEEC) models for on-chip passives and interconnects
- On driving non-passive macromodels to instability
- Recent developments on hybrid time-frequency numerical simulation techniques for RF and microwave applications
- Full‐wave‐based transmission‐line model for lossy‐substrate multiconductor interconnects
- A reduction technique of large-scale RCG interconnects in the complex frequency domain
- Computational Science – ICCS 2005
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