Physical modeling, theoretical analysis, and experimental test of via holes in microwave planar circuits

DOI10.1108/03321641011015011zbMATH Open1186.78019OpenAlexW2000372692MaRDI QIDQ3559709FDOQ3559709

Authors: Yu Tian, Ling Tong 

Publication date: 7 May 2010

Published in: COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1108/03321641011015011

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zbMATH Keywords

modellingmicrowavesmicrowave circuitsmicrovias

Mathematics Subject Classification ID

Waves and radiation in optics and electromagnetic theory (78A40) Antennas, waveguides in optics and electromagnetic theory (78A50) Method of moments applied to problems in optics and electromagnetic theory (78M05)

Cited In (3)

• Novel hybrid analysis method for via structure in microwave multilayer circuits
• Study on the application range of the MP-MM in vias analyzing
• Comparison between theoretical and measured shielded microstrip dispersion properties in a wide-frequency range

Uses Software

• Matlab

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