Thermal-stress induced phenomena in two-component material. I
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Publication:358714
DOI10.1007/S10409-009-0316-9zbMATH Open1269.74194OpenAlexW3146742859MaRDI QIDQ358714FDOQ358714
Authors: Ladislav Ceniga
Publication date: 9 August 2013
Published in: Acta Mechanica Sinica (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10409-009-0316-9
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Cites Work
Cited In (12)
- Thermal stresses in two- and three-component anisotropic materials
- Spontaneous fracture of growing precipitates with large misfit strain
- Cracking in heat-releasing perforated material
- Short Lecture Sessions
- Prediction of thermal crack spacing
- Thermal-stress induced phenomena in two-component material. II
- Analytical model of thermal stresses in two- and three-component materials II
- Analytical model of thermal-stress induced cracking in two-component material with anisotropic components
- Thermal field around a partially debonded spherical particle
- Title not available (Why is that?)
- Quantitative law of diffusion induced fracture
- Fracture of hollow multiply-twinned particles under chemical etching
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