Hybrid singular element design for the bending analysis of bimaterial thin cracked plates
DOI10.2514/3.9456zbMATH Open0605.73077OpenAlexW2015841249MaRDI QIDQ3742865FDOQ3742865
Authors: Wen-Hwa Chen, Chyanbin Hwu
Publication date: 1986
Published in: AIAA Journal (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.2514/3.9456
Recommendations
- A singular element for Reissner plate bending problem with interface cracks
- A finite element alternating approach to the bending of thin plates containing mixed mode cracks
- Stress analysis of finite interfacially cracked bimaterial plates by using the variational method
- Dynamic analysis of cracks perpendicular to bimaterial interfaces using a new singular finite element
- Analysis of singular stresses in bonded bimaterial wedges by computed eigen solutions and hybrid element method
interface crackbendingstress intensity factorstransverse deflectionhybrid singular crack elementsingular and oscillatory characters of the stress fieldthin bimaterial plates
Composite and mixture properties (74E30) Plates (74K20) Brittle damage (74R05) Finite element methods applied to problems in solid mechanics (74S05)
Cited In (5)
- Title not available (Why is that?)
- Hybrid semiLoof element for buckling of thin-walled structures
- A finite element alternating approach to the bending of thin plates containing mixed mode cracks
- A singular element for Reissner plate bending problem with interface cracks
- Stress analysis of finite interfacially cracked bimaterial plates by using the variational method
This page was built for publication: Hybrid singular element design for the bending analysis of bimaterial thin cracked plates
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q3742865)