Anti-plane dynamic hole-crack interaction in a functionally graded piezoelectric media
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Publication:396065
DOI10.1007/S00419-011-0541-0zbMATH Open1293.74379OpenAlexW1968476311MaRDI QIDQ396065FDOQ396065
Authors: R. Mueller, D. Gross, Petia S. Dineva, Tsviatko V. Rangelov 
Publication date: 8 August 2014
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00419-011-0541-0
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anti-plane deformation stateBIEMfunctionally graded piezoelectric material (FGPM)hole-crack interactionSCFsSIFs
Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10) Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35)
Cites Work
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- Well-Posedness of Initial-Boundary Value Problems for Piezoelectric Equations
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Cited In (5)
- Stress concentration factor in functionally graded plates with circular holes subjected to anti-plane shear loading
- Dynamic intensity factors for multiple permeable cracks in piezoelectric materials
- Anti-plane scattering by heterogeneities in piezoelectric plane by BIEM
- Dynamic stress and electric field concentration in a functionally graded piezoelectric solid with a circular hole
- Dynamic performance for piezoelectric bi-materials with an interfacial crack near an eccentric elliptical hole under anti-plane shearing
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