Transient thermal elastic fracture of a piezoelectric cylinder specimen
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Publication:398028
DOI10.1007/S00419-012-0713-6zbMATH Open1293.74370OpenAlexW1975867359MaRDI QIDQ398028FDOQ398028
Authors: D. M. Chang, B. L. Wang
Publication date: 12 August 2014
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00419-012-0713-6
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Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10)
Cites Work
- Coupled thermoelasticity of functionally graded cylindrical shells
- Stress intensity factors for external and penny-shaped cracks in transversely isotropic cylinders subjected to thermal shock
- Electroelastic analysis of a piezoelectric cylindrical fiber with a penny-shaped crack embedded in a matrix.
- Three-dimensional transient piezothermoelasticity in functionally graded rectangular plate bonded to a piezoelectric plate
- Crack spacing effect for a piezoelectric cylinder under electro-mechanical loading or transient heating
- Control of thermal stress intensity factor in a piezothermoelastic semi-infinite body with an edge crack
- Dynamic focusing effect of piezoelectric fibers subjected to thermal shock
- Fracture Analysis for Two-dimensional Plane Problems of Nonhomogeneous Magneto-electro-thermo-elastic Plates Subjected to Thermal Shock by Using the Meshless Local Petrov-Galerkin Method
- Title not available (Why is that?)
- Thermal Shock in a Hollow Sphere Caused by Rapid Uniform Heating
- Transient thermal stresses in a transversely isotropic finite circular cylinder due to an arbitrary internal heat-generation
- Exact electromagnetothermoelastic solution for a transversely isotropic piezoelectric hollow sphere subjected to arbitrary thermal shock
- The analysis of thermal stresses in thermopiezoelastic semi-infinite body with an edge crack
- Dynamic 3D axisymmetric problems in continuously non-homogeneous piezoelectric solids
- Fracture analysis in continuously nonhomogeneous magneto-electro-elastic solids under a thermal load by the MLPG
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