Thermal stresses factors of orthotropic graded layers with a finite line bond
DOI10.1007/S00419-013-0728-7zbMATH Open1293.74078OpenAlexW2034882093MaRDI QIDQ398158FDOQ398158
Authors: Junqiao Liu, Peiyuan Liu, Li Xing
Publication date: 12 August 2014
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00419-013-0728-7
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singular integral equationsthermal stress intensity factors (TSIFs)finite line bondorthotropic functionally graded layer
Composite and mixture properties (74E30) Thermal effects in solid mechanics (74F05) Anisotropy in solid mechanics (74E10) Stress concentrations, singularities in solid mechanics (74G70)
Cites Work
- The Crack Problem in Bonded Nonhomogeneous Materials
- Interface crack in a nonhomogeneous elastic medium
- Thermal stress intensity factors for an interface crack in a functionally graded layered structures
- The Surface Crack Problem for a Plate With Functionally Graded Properties
- Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure
- A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply
Cited In (4)
- Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
- The effect of oblique functional gradation to transient thermal stresses in the functionally graded infinite strip
- The effect of oblique functional gradation to thermal stresses in the functionally graded infinite strip
- Thermoelastic closed-form solutions of FGM plates subjected to temperature change in longitudinal and thickness directions
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