Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate
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Recommendations
- Stress analysis of a mode I edge delamination specimen for compositematerials
- Interface crack problems in layered orthotropic materials
- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
- Influence of interfacial delamination on channel cracking of elastic thin films
- Stress intensity factor of an edge crack in bonded orthotropic materials
Cites work
- Application of an orthotropy rescaling method to edge cracks and kinked cracks in orthotropic two-dimensional solids
- Asymptotic analysis of cracks in the adhesive layer of an orthotropic sandwich structure
- Dependence of stress on elastic constants in an anisotropic bimaterial under plane deformation; and the interfacial crack
- Elastostatic analysis of edge cracked orthotropic strips
- Mixed Mode Cracking in Layered Materials
- Mode II Edge Delamination of Compressed Thin Films
- Singularities, interfaces and cracks in dissimilar anisotropic media
- The asymptotic structure of small-scale yielding interfacial free-edge joint and crack-tip fields
- The edge cracking and decohesion of thin films
Cited in
(5)- Edge effect in a two-layer orthotropic strip
- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
- Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate
- The effect of material anisotropy on the mechanics of a thin-film/substrate system under mechanical and thermal loads
- Two-dimensional analysis of progressive delamination in thin film electrodes
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