Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate

DOI10.1007/S00707-013-1084-YzbMATH Open1302.74106OpenAlexW2033749652MaRDI QIDQ405037FDOQ405037

Authors: G. H. Lee, C. B. Cui, H. G. Beom 

Publication date: 4 September 2014

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-013-1084-y

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Mathematics Subject Classification ID

Structured surfaces and interfaces, coexistent phases (74A50) Thin films (74K35)

Cites Work

• Mixed Mode Cracking in Layered Materials
• Application of an orthotropy rescaling method to edge cracks and kinked cracks in orthotropic two-dimensional solids
• Dependence of stress on elastic constants in an anisotropic bimaterial under plane deformation; and the interfacial crack
• Asymptotic analysis of cracks in the adhesive layer of an orthotropic sandwich structure
• Singularities, interfaces and cracks in dissimilar anisotropic media
• Elastostatic analysis of edge cracked orthotropic strips
• The edge cracking and decohesion of thin films
• The asymptotic structure of small-scale yielding interfacial free-edge joint and crack-tip fields
• Mode II Edge Delamination of Compressed Thin Films

Cited In (5)

• Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
• The effect of material anisotropy on the mechanics of a thin-film/substrate system under mechanical and thermal loads
• Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate
• Edge effect in a two-layer orthotropic strip
• Two-dimensional analysis of progressive delamination in thin film electrodes

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