Stress Concentration Factors at an Elliptical Hole on the Interface Between Bonded Dissimilar Half-Planes Under Bending Moment

DOI10.1115/1.2787213MaRDI QIDQ4339684zbMATH OpenOpenAlexFDO

Authors M. Salama, Norio Hasebe

Publication date 7 August 1997

Published in Journal of Applied Mechanics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1115/1.2787213

zbMATH Keywords

stress intensity factorcomplex stress function approachrational mapping function technique

Mathematics Subject Classification ID

Plates (74K20) Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35) Fracture and damage (74R99) Stress concentrations, singularities in solid mechanics (74G70)

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Cited in

(8)

• Green's function of a point dislocation for the bending of a composite infinite plate with an elliptical hole at interface
• Anti-plane shear stress problem of two bonded dissimilar half-spaces with an elliptical hole or rigid inclusion on the interface
• Stress concentration in a layered plane with an elliptical cutout
• Thin plate bending problem of partially bonded bi-material strips
• Stress state in the vicinity of an inclined elliptical defect and stress intensity factors for biaxial loading of a plate
• An eigenfunction expansion solution for three-dimensional stress field in the vicinity of the circumferential line of intersection of a bimaterial interface and a hole
• Stresses in bonded half-plates weakened by a circular hole
• Interacting Stress Intensity Factors of Multiple Elliptical-Holes and Cracks Under Far-Field and Arbitrary Surface Stresses

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