Stress Concentration Factors at an Elliptical Hole on the Interface Between Bonded Dissimilar Half-Planes Under Bending Moment
DOI10.1115/1.2787213zbMATH Open0878.73011OpenAlexW2020939308MaRDI QIDQ4339684FDOQ4339684
Authors: M. Salama, Norio Hasebe
Publication date: 7 August 1997
Published in: Journal of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1115/1.2787213
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Cited In (8)
- Green's function of a point dislocation for the bending of a composite infinite plate with an elliptical hole at interface
- Anti-plane shear stress problem of two bonded dissimilar half-spaces with an elliptical hole or rigid inclusion on the interface
- Stress concentration in a layered plane with an elliptical cutout
- Thin plate bending problem of partially bonded bi-material strips
- Stress state in the vicinity of an inclined elliptical defect and stress intensity factors for biaxial loading of a plate
- An eigenfunction expansion solution for three-dimensional stress field in the vicinity of the circumferential line of intersection of a bimaterial interface and a hole
- Stresses in bonded half-plates weakened by a circular hole
- Interacting Stress Intensity Factors of Multiple Elliptical-Holes and Cracks Under Far-Field and Arbitrary Surface Stresses
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