On Bonded Circular Inclusions in Plane Thermoelasticity
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Publication:4398159
DOI10.1115/1.2788962zbMATH Open0900.73078OpenAlexW1987082329MaRDI QIDQ4398159FDOQ4398159
Authors: C. K. Chao, M. H. Shen 
Publication date: 15 November 1998
Published in: Journal of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1115/1.2788962
Cited In (7)
- Contact stresses in an infinite plate containing a rigid circular inclusion under thermal loads
- An alternative numerical scheme for calculating the thermal stresses around an inclusion of arbitrary shape in an elastic plane under uniform remote in-plane heat flux
- Interaction between heat dipole and circular interfacial crack
- Closed‐form solutions for a circular inhomogeneity in nonlinearly coupled thermoelectric materials
- Green's function for a point heat source embedded in an infinite body with two circular elastic inclusions
- A novel hybrid technique to decompose in-plane thermoelastic displacement fields into thermal and structural displacement fields
- A new special coating/fiber element for analyzing effect of interface on thermal conductivity of composites
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