Analysis of fatigue delamination growth in flip-chip package
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Publication:478321
DOI10.1007/s00707-014-1201-6zbMath1302.74149MaRDI QIDQ478321
Publication date: 3 December 2014
Published in: Acta Mechanica (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00707-014-1201-6
74R20: Anelastic fracture and damage
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