On Boundary Integral Equations for Cracked and for thin Bodies
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Publication:4789765
DOI10.1177/108128650100600103zbMATH Open1042.74055OpenAlexW2080662944MaRDI QIDQ4789765FDOQ4789765
Publication date: 14 April 2003
Published in: Mathematics and Mechanics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1177/108128650100600103
Cites Work
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Cited In (8)
- On the conventional boundary integral equation formulation for piezoelectric solids with defects or of thin shapes.
- Analysis of thin piezoelectric solids by the boundary element method
- Electrostatic BEM for MEMS with thin conducting plates and shells
- Error estimation using hypersingular integrals in boundary element methods for linear elasticity.
- Two adhesive-contact models for quasistatic mixed-mode delamination problems
- Integral equation formulation for thin shells-revisited
- Quasistatic adhesive contact delaminating in mixed mode and its numerical treatment
- Electrostatic BEM for MEMS with thin beams
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