Hypocycloidal inclusions in nonuniform out-of-plane elasticity: stress singularity vs. stress reduction
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Abstract: Stress field solutions and Stress Intensity Factors (SIFs) are found for -cusped hypocycloidal shaped voids and rigid inclusions in an infinite linear elastic plane subject to nonuniform remote antiplane loading, using complex potential and conformal mapping. It is shown that a void with hypocycloidal shape can lead to a higher SIF than that induced by a corresponding star-shaped crack; this is counter intuitive as the latter usually produces a more severe stress field in the material. Moreover, it is observed that when the order of the polynomial governing the remote loading grows, the stress fields generated by the hypocycloidal-shaped void and the star-shaped crack tend to coincide, so that they become equivalent from the point of view of a failure analysis. Finally, special geometries and loading conditions are discovered for which there is no stress singularity at the inclusion cusps and where the stress is even reduced with respect to the case of the absence of the inclusion. The concept of Stress Reduction Factor (SRF) in the presence of a sharp wedge is therefore introduced, contrasting with the well-known definition of Stress Concentration Factor (SCF) in the presence of inclusions with smooth boundary. The results presented in this paper provide criteria that will help in the design of ultra strong composite materials, where stress singularities always promote failure. Furthermore, they will facilitate finding the special conditions where resistance can be optimized in the presence of inclusions with non-smooth boundary.
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Cited in
(5)- On the three-dimensional singular stress field near the corner front of revolution-shaped inclusions
- Torsion of elastic solids with sparse voids parallel to the twist axis
- Perturbation of the elastic and thermoelectric fields caused by a rigid inclusion in a thermo-electro-elastic full plane
- Multi-scale asymptotic expansion for a small inclusion in elastic media
- Fracture analysis for a cusp-type crack problem
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