Inverse Modeling: Glue-Package-Die Problem
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Publication:5115079
DOI10.1007/978-3-030-30726-4_12OpenAlexW2984673696MaRDI QIDQ5115079FDOQ5115079
Authors: Roland Pulch, Piotr Putek, Herbert De Gersem, Renaud Gillon
Publication date: 29 June 2020
Published in: Mathematics in Industry (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/978-3-030-30726-4_12
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