3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

DOI10.1109/TC.2013.127MaRDI QIDQ5267400zbMATH OpenOpenAlexFDO

Authors Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler

Publication date 20 June 2017

Published in IEEE Transactions on Computers (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1109/tc.2013.127

Mathematics Subject Classification ID

Applications of design theory to circuits and networks (94C30)

Cited in

(1)

• Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics

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