3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

DOI10.1109/TC.2013.127zbMATH Open1364.94836OpenAlexW2025110944MaRDI QIDQ5267400FDOQ5267400

Thomas Brunschwiler, Arvind Sridhar, David Atienza, Alessandro Vincenzi

Publication date: 20 June 2017

Published in: IEEE Transactions on Computers (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1109/tc.2013.127

Mathematics Subject Classification ID

Applications of design theory to circuits and networks (94C30)

Cited In (1)

• Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics

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