Cooling augmentation using microchannels with rotatable separating plates
DOI10.1016/J.IJHEATMASSTRANSFER.2011.02.054zbMATH Open1219.80060OpenAlexW4243035556MaRDI QIDQ550798FDOQ550798
Authors: A.-R. A. Khaled, K. Vafai 
Publication date: 13 July 2011
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2011.02.054
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Cites Work
- Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
- Finite difference methods of solution of the boundary-layer equations
- Comparative analysis of jet impingement and microchannel cooling for high heat flux applications
- Heat exchangers. Selection, rating, and thermal design
- The heat transfer characteristics of liquid cooling heatsink containing microchannels
- Analysis of flexible microchannel heat sink systems
- Fluid flow and heat transfer in wavy microchannels
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