A Two-Dimensional Thermoelastic Analysis of a Cylindrical Shell Made of FGM with Temperature-Dependent Physical Properties
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Publication:5889042
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Cites work
- A nonlinear analysis of thermal stresses in an incompressible functionally graded hollow cylinder with temperature-dependent material properties
- A note on thermal stresses in hollow cylinders
- Analysis of the thermal stress behaviour of functionally graded hollow circular cylinders.
- Axisymmetric non-Fourier temperature field in a hollow sphere
- Functionally graded hollow cylinder under pressure and thermal loading: effect of material parameters on stress and temperature distributions
- Modelling functionally graded materials in heat transfer and thermal stress analysis by means of graded finite elements
- Nonlinear thermoelasticity, vibration, and stress wave propagation analyses of thick FGM cylinders with temperature-dependent material properties
- Nonlinear transient thermal stress analysis of thick-walled FGM cylinder with temperature-dependent material properties
- Nonlinear transient thermal stress and elastic wave propagation analyses of thick temperature-dependent FGM cylinders, using a second-order point-collocation method
- Steady symmetrical temperature field in a hollow spherical particle with temperature-dependent thermal conductivity
- The effect of temperature-dependent viscosity and thermal conductivity on velocity and temperature field: an analytical solution using the perturbation technique
- Thermal analysis of 2D FGM beam subjected to thermal loading using meshless weighted least-square method
- Thermoelastic problem for an isotropic sphere with temperature dependent properties
Cited in
(4)- Nonlinear thermoelasticity, vibration, and stress wave propagation analyses of thick FGM cylinders with temperature-dependent material properties
- Investigation on electrothermoelastic behavior of FGPM cylindrical shells
- Two-dimensional piezothermoelastic analysis of a smart FGM hollow sphere
- Electro-thermo-mechanical behaviors of FGPM spheres using analytical method and ANSYS software
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