Modeling diffusional coarsening in eutectic tin/lead solders: A quantitative approach
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Publication:5926650
DOI10.1016/S0020-7683(00)00103-7zbMath0961.74523OpenAlexW2063850717MaRDI QIDQ5926650
Wolfgang Dreyer, Wolfgang H. Müller
Publication date: 17 May 2001
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0020-7683(00)00103-7
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