Thermal conduction of a circular inclusion with variable interface parameter.
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Publication:5933933
DOI10.1016/S0020-7683(00)00191-8zbMath1058.80504MaRDI QIDQ5933933
Publication date: 2001
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Related Items (6)
Thermal Green's functions in plane anisotropic bimaterials with spring-type and Kapitza-type imperfect interface ⋮ Two models of three-dimensional thin interphases with variable conductivity and their fulfillment of the reciprocal theorem ⋮ Scattering of antiplane shear wave by a piezoelectric circular cylinder with an imperfect interfaces ⋮ New phenomena concerning a screw dislocation interacting with two imperfect interfaces ⋮ The analysis of inter-laminar stress and electric potential for a laminated piezoelectric plate with interfacial damage ⋮ Two circular inclusions with arbitrarily varied surface effects
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