Delamination of compressed films on curved substrates
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Publication:5953044
DOI10.1016/S0022-5096(01)00029-1zbMATH Open0998.74048WikidataQ127571493 ScholiaQ127571493MaRDI QIDQ5953044FDOQ5953044
Authors: John W. Hutchinson 
Publication date: 26 November 2002
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
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delaminationenergy release ratefracture mechanicsresidual stresssubstrate curvaturethin elastic filmsequi-biaxial compressive pre-stress
Cites Work
Cited In (12)
- Delamination of compressed thin layers at corners
- Buckling-driven delamination in layered spherical shells
- A multilayer film coating with slightly curved boundary
- Mode-dependent toughness and the delamination of compressed thin films
- On thin film delamination growth in a contracting cylinder
- Buckling delamination in compressed multilayers on curved substrates with accompanying ridge cracks
- On the deformation of coated functionally graded structures with delamination
- Free-edge stresses and progressive cracking in surface coatings of circular torsion bars
- Anisotropic buckling patterns in spheroidal film/substrate systems and their implications in some natural and biological systems
- Effect of interface profile and stress-strain properties of substrate onto stability loss of thermal barrier coating under thermal impact
- Growth-induced blisters in a circular tube
- Title not available (Why is that?)
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