3-D finite element simulation of wafer thermal distortion and stress fields in exposure process

DOI10.1016/S0017-9310(01)00163-6MaRDI QIDQ5956667zbMATH OpenFDO

Authors Zone-Ching Lin, Wen-Jang Wu

Publication date 22 July 2002

Published in International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/S0017-9310(01)00163-6

zbMATH Keywords

ExposureFinite element methodThermal deformationThermal stressWafer

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Finite element methods applied to problems in solid mechanics (74S05)

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• A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography
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