Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading

DOI10.1016/S0020-7683(01)00206-2MaRDI QIDQ5956745zbMATH OpenFDO

Authors A. Barut, I. Guven, Erdogan Madenci

Publication date 2001

Published in International Journal of Solids and Structures (Search for Journal in Brave)

zbMATH Keywords

eigenfunction expansion methodglobal elementhybrid global element

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Finite element methods applied to problems in solid mechanics (74S05) Junctions (74K30) Stress concentrations, singularities in solid mechanics (74G70)

Recommendations

• Finite element analysis of anisotropic materials with singular inplane stress fields
• Analysis of singular stress fields at multi-material corners under thermal loading
• Stress singularities in a dissimilar materials joint with edge tractions under mechanical and thermal loadings
• Stress intensity factor analysis of an interface crack between dissimilar anisotropic materials under thermal stress using the finite element analysis
• Singular stresses in a finite region of two dissimilar viscoelastic materials with traction-free edges

Cited in

(10)

• Stress components and loading restrictions at the vertices of regular triangular and quadrangular pyramids
• Analysis of singular stress fields at multi-material corners under thermal loading
• Computations of singular stresses along three-dimensional corner fronts by a super singular element method
• On the three-dimensional singular stress field near the corner front of revolution-shaped inclusions
• Singular stresses in a finite region of two dissimilar viscoelastic materials with traction-free edges
• Non-singular stresses in gradient elasticity at bi-material interface with transverse crack
• Gradient elastic stress analysis for anisotropic bimaterial interface with arbitrarily oriented crack
• Stress singularities in a dissimilar materials joint with edge tractions under mechanical and thermal loadings
• Restrictions on stress components in the top of round cone
• Singularities in bi-materials: Parametric study of an isotropic/anisotropic joint

Describes a project that uses

Uses Software

• ANSYS

This page was built for publication: Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q5956745)