Thermal stressed state of a bimaterial with interface crack filled with a compressible liquid

DOI10.1007/S10958-023-06404-2zbMATH Open1515.74020OpenAlexW4367845733MaRDI QIDQ6044599FDOQ6044599

Kh. I. Serednytska

Publication date: 22 May 2023

Published in: Journal of Mathematical Sciences (New York) (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10958-023-06404-2

zbMATH Keywords

thermoelasticitythermal resistancenonlinear singular integrodifferential equationmode-II stress intensity factor

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Fluid-solid interactions (including aero- and hydro-elasticity, porosity, etc.) (74F10) Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• Thermoelastic analysis for an opening crack in an orthotropic material
• Effect of heat-conductive filler of interface gap on thermoelastic contact of solids
• Title not available (Why is that?)

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