Thermal stressed state of a bimaterial with interface crack filled with a compressible liquid

DOI10.1007/S10958-023-06404-2MaRDI QIDQ6044599zbMATH OpenOpenAlexFDO

Authors Kh. I. Serednytska

Publication date 22 May 2023

Published in Journal of Mathematical Sciences (New York) (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s10958-023-06404-2

zbMATH Keywords

mode-II stress intensity factornonlinear singular integrodifferential equationthermal resistancethermoelasticity

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Fluid-solid interactions (including aero- and hydro-elasticity, porosity, etc.) (74F10) Stress concentrations, singularities in solid mechanics (74G70) Brittle fracture (74R10)

Cites work

• Effect of heat-conductive filler of interface gap on thermoelastic contact of solids
• scientific article; zbMATH DE number 6387978 (Why is no real title available?)
• Thermoelastic analysis for an opening crack in an orthotropic material

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