Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

DOI10.1007/S10483-023-2989-7MaRDI QIDQ6132278zbMATH OpenFDO

Authors HuaYang Dang, Dongpei Qi, MingHao Zhao, CuiYing Fan, Chunsheng Lu

Publication date 14 July 2023

Published in AMM. Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

zbMATH Keywords

Chebyshev polynomialstress intensity factor (SIF)thermal variationinterfacial behaviorone-dimensional (1D) hexagonal quasicrystal (QC) film

Mathematics Subject Classification ID

Classical linear elasticity (74B05) Thermal effects in solid mechanics (74F05) Quasicrystals and aperiodic tilings in discrete geometry (52C23)

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Cites work

• scientific article; zbMATH DE number 3084088 (Why is no real title available?)
• An exact closed-form solution for a multilayered one-dimensional orthorhombic quasicrystal plate
• Beam theory models for thin film segments cohesively bonded to an elastic half space
• Fundamental solutions of penny-shaped and half-infinite plane cracks embedded in an infinite space of one-dimensional hexagonal quasi-crystal under thermal loading
• Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure
• On the electroelastic behaviour of a thin piezoelectric actuator attached to an infinite host structure
• The Problem of an Elastic Stiffener Bonded to a Half Plane
• The edge cracking and decohesion of thin films
• Thermally induced deformations in a partially coated elastic layer
• Thin Film Materials
• Three-dimensional interfacial fracture analysis of a one-dimensional hexagonal quasicrystal coating

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