Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

DOI10.1007/S10483-023-2989-7zbMATH Open1518.52015MaRDI QIDQ6132278FDOQ6132278

Chunsheng Lu, HuaYang Dang, Dongpei Qi, MingHao Zhao, CuiYing Fan

Publication date: 14 July 2023

Published in: AMM. Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

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zbMATH Keywords

Chebyshev polynomialstress intensity factor (SIF)thermal variationinterfacial behaviorone-dimensional (1D) hexagonal quasicrystal (QC) film

Mathematics Subject Classification ID

Classical linear elasticity (74B05) Thermal effects in solid mechanics (74F05) Quasicrystals and aperiodic tilings in discrete geometry (52C23)

Cites Work

• Title not available (Why is that?)
• Thin Film Materials
• Fundamental solutions of penny-shaped and half-infinite plane cracks embedded in an infinite space of one-dimensional hexagonal quasi-crystal under thermal loading
• Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure
• The edge cracking and decohesion of thin films
• Beam theory models for thin film segments cohesively bonded to an elastic half space
• An exact closed-form solution for a multilayered one-dimensional orthorhombic quasicrystal plate
• On the electroelastic behaviour of a thin piezoelectric actuator attached to an infinite host structure
• Thermally induced deformations in a partially coated elastic layer
• The Problem of an Elastic Stiffener Bonded to a Half Plane
• Three-dimensional interfacial fracture analysis of a one-dimensional hexagonal quasicrystal coating

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