Bond zone model for a conductive crack at the interface of piezoelectric materials under anti‐plane mechanical and in‐plane electric loadings
From MaRDI portal
Publication:6153288
DOI10.1002/zamm.201800230WikidataQ127638846 ScholiaQ127638846MaRDI QIDQ6153288
Unnamed Author, Volodymyr Loboda, Yu. N. Lapusta, Alla Sheveleva
Publication date: 13 February 2024
Published in: ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik (Search for Journal in Brave)
Fracture and damage (74Rxx) Equilibrium (steady-state) problems in solid mechanics (74Gxx) Coupling of solid mechanics with other effects (74Fxx)
Cites Work
- Unnamed Item
- Contact between an elastic half-plane and a partly separated stamp
- Multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate
- An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound
- Fracture mechanics for piezoelectric ceramics
- A moving conducting crack at the interface of two dissimilar piezoelectric materials.
- Antiplane interface crack between two bonded dissimilar piezoelectric layers.
- Fracture-mechanical assessment of electrically permeable interface cracks in piezoelectric bimaterials by consideration of various contact zone models
- Interface crack between piezoelectric and elastic strips
- A conducting arc crack between a circular piezoelectric inclusion and an unbounded matrix
- Out-of-plane interface cracks in dissimilar piezoelectric materials
- Dislocation-based fracture analysis of functionally graded magnetoelectroelastic solids
- Dynamic response of a cracked magnetoelectroelastic layer sandwiched between two elastic layers
- The Mode III Interface Crack in Piezo-Electro-Magneto-Elastic Dissimilar Bimaterials
- The Interface Crack
- Analysis of a bi-piezoelectric ceramic layer with an interfacial crack subjected to anti-plane shear and in-plane electric loading
This page was built for publication: Bond zone model for a conductive crack at the interface of piezoelectric materials under anti‐plane mechanical and in‐plane electric loadings