Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles

DOI10.1016/J.CAM.2011.05.018MaRDI QIDQ651924zbMATH OpenOpenAlexFDO

Authors Shan Wang, Zhiping Li

Publication date 19 December 2011

Published in Journal of Computational and Applied Mathematics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.cam.2011.05.018

zbMATH Keywords

Chebyshev collocation methodelastic thin filminitial residual stressinterface toughnesstelephone cord bucklesvon Kármán plate equations

Mathematics Subject Classification ID

Spectral, collocation and related methods for boundary value problems involving PDEs (65N35) Structured surfaces and interfaces, coexistent phases (74A50) Thin films (74K35)

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Cites work

• Collocation methods for the solution of von-Kármán dynamic nonlinear plate systems
• scientific article; zbMATH DE number 1014910 (Why is no real title available?)
• Mathematical modeling and numerical simulation of telephone cord buckles of elastic films
• Mixed Mode Cracking in Layered Materials
• Spectral and high-order methods with applications.

Cited in

(2)

• Modeling of elastoplastic behavior of freestanding square thin films under bulge testing
• Mathematical modeling and numerical simulation of telephone cord buckles of elastic films

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