Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium

DOI10.1016/0020-7683(95)00008-XMaRDI QIDQ675659zbMATH OpenOpenAlexFDO

Authors M. H. Shen, C. K. Chao

Publication date 9 March 1997

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/0020-7683(95)00008-x

zbMATH Keywords

complex potentialcontinuity conditionsdislocation functionssingular integral equationsthermal stress intensity factors

Mathematics Subject Classification ID

Fracture and damage (74R99)

Review text

The proposed method for solving the title problem consists of two parts. In the first part, complex potential functions are derived which are enforced to satisfy the continuity conditions across the interface, while the second part consists of the derivation of singular integral equations by introducing the dislocation functions along the crack border which are solved numerically. For both half-plane and two bonded half-plane problems associated with an insulated crack, the thermal stress intensity factors are computed numerically.

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