Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium
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Publication:675659
DOI10.1016/0020-7683(95)00008-XzbMATH Open0874.73054OpenAlexW1972130813MaRDI QIDQ675659FDOQ675659
Authors: M. H. Shen, C. K. Chao 
Publication date: 9 March 1997
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/0020-7683(95)00008-x
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- Thermoelastic interface crack problems in dissimilar anisotropic media
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- An investigation on a two-dimensional problem of Mode-I crack in a thermoelastic medium
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- Thermoelastic problem of curvilinear cracks in bonded dissimilar materials
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