The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading
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Publication:735281
DOI10.1007/S10483-008-1112-ZzbMATH Open1353.74053OpenAlexW2092559801MaRDI QIDQ735281FDOQ735281
Authors: Yan-hong Cai, Liqiang Tang, Cheng Yan, Wan Jiang, Hao Ran Chen 
Publication date: 21 October 2009
Published in: Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)
Full work available at URL: https://eprints.qut.edu.au/18478/1/18478c.pdf
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Cites Work
Cited In (6)
- Interface behavior of a bi-material plate under dynamic loading. Cohesive interface debonding
- Interface delamination of bi-material structure under dynamic time harmonic loading
- Strain energy release rate under dynamic loading considering shear and crack tip root rotation effects
- Steady-state growing crack-tip field characteristics of mode III elastic-viscoplastic/rigid interface cracks
- Dynamic fracture analysis of adhesive bonded material under normal loading
- Numerical analysis of directionally unstable crack propagation in adhesively bonded joints.
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