The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

DOI10.1007/S10483-008-1112-ZMaRDI QIDQ735281zbMATH OpenOpenAlexFDO

Authors Yan-hong Cai, Liqiang Tang, Cheng Yan, Wan Jiang, Hao Ran Chen

Publication date 21 October 2009

Published in Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

Full work available at URL https://eprints.qut.edu.au/18478/1/18478c.pdf

Mathematics Subject Classification ID

Junctions (74K30)

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Cites work

• scientific article; zbMATH DE number 3576096 (Why is no real title available?)
• Damage theory for polymeric material
• Singularity of dynamic stress fields around an interface crack between viscoelastic bodies
• Vapor pressure and void size effects on failure of a constrained ductile film

Cited in

(6)

• Numerical analysis of directionally unstable crack propagation in adhesively bonded joints.
• Interface behavior of a bi-material plate under dynamic loading. Cohesive interface debonding
• Dynamic fracture analysis of adhesive bonded material under normal loading
• Steady-state growing crack-tip field characteristics of mode III elastic-viscoplastic/rigid interface cracks
• Strain energy release rate under dynamic loading considering shear and crack tip root rotation effects
• Interface delamination of bi-material structure under dynamic time harmonic loading

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