Micromechanics modeling of strength for nanocrystalline copper
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Publication:835385
DOI10.1007/S00419-007-0168-3zbMATH Open1168.74415OpenAlexW2032990796MaRDI QIDQ835385FDOQ835385
Authors: Jiaoxia Lan, You-Shi Hong
Publication date: 28 August 2009
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: http://dspace.imech.ac.cn/handle/311007/26078
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Cites Work
- Continuum micro-mechanics of elastoplastic polycrystals
- Effective elastoplastic behavior of metal composites containing randomly located aligned spheroidal inhomogeneities. I: Micromechanics-based formulation. II: Applications
- Title not available (Why is that?)
- Micromechanics modeling of composite with ductile matrix and shape memory alloy reinforcement
Cited In (14)
- The ``inverse Hall-Petch effect on the impact response of single crystal copper
- The scale effect on the yield strength of nanocrystalline materials
- A generalized self-consistent polycrystal model for the yield strength of nanocrystalline materials
- Mechanics of creep resistance in nanocrystalline solids
- The competition of grain size and porosity in the viscoplastic response of nanocrystalline solids
- A theory of compressive yield strength of nano-grained ceramics
- Mechanics modeling for deformation of nano-grained metals
- Atomistic and mean-field estimates of effective stiffness tensor of nanocrystalline copper
- Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates
- A micromechanical model of toughening behavior in the dual-phase composite
- Modeling of strengthening and softening in inelastic nanocrystalline materials with reference to the triple junction and grain boundaries using strain gradient plasticity
- A variational multiscale constitutive model for nanocrystalline materials
- Brittle versus ductile transition of nanocrystalline metals
- Atomistic based continuum investigation of plastic deformation in nanocrystalline copper
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