Peeling experiments of ductile thin films along ceramic substrates - critical assessment of analytical models

DOI10.1016/J.IJSOLSTR.2007.10.023MaRDI QIDQ837367zbMATHOpenAlexFDO

Authors Y. Wei, Hai-feng Zhao

Publication date 10 September 2009

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL http://dspace.imech.ac.cn/handle/311007/26024

zbMATH Keywords

analytical modelinterfacial fracture energymetal thin filmpeel experiment

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

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Cites work

• Constraint effects in adhesive joint fracture
• Modeling nonlinear peeling of ductile thin films -- critical assessment of analytical bending models using FE simulations
• Numerical simulations of adhesively-bonded beams failing with extensive plastic deformation.
• Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity
• The influence of plasticity on mixed mode interface toughness

Cited in

(2)

• Modeling nonlinear peeling of ductile thin films -- critical assessment of analytical bending models using FE simulations
• Analyses of crack growth along interface of patterned wafer-level cu-cu bonds

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