Role of the contact layer between liquid and solid on a solidification process

DOI10.1016/S0017-9310(02)00531-8MaRDI QIDQ1415723zbMATH OpenOpenAlexFDO

Authors Zygmunt Lipnicki

Publication date 9 December 2003

Published in International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0017-9310(02)00531-8

Mathematics Subject Classification ID

Stefan problems, phase changes, etc. (80A22) Multiphase and multicomponent flows (76T99)

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Cited in

(8)

• ON THE INFLUENCE OF THE DEFORMATION OF THE FORMING SOLID IN THE SOLIDIFICATION OF A SEMI-INFINITE WATER LAYER OF FLUID
• Initial solidification in liquid metal film flow over a moving boundary
• Dynamical cooling of semiconductor by contact layer
• Heat and mass transfer predictions of the early contact of a liquid metal on an intensely cooled moving substrate
• scientific article; zbMATH DE number 1755183 (Why is no real title available?)
• Solidification of a ternary alloy liquid layer on a substrate subject to self-consistent melting
• Ideal solidification of a liquid-metal boundary layer flow over a conveying substrate
• Simulation of the microstructure of a thin metal layer quenched from a liquid state

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