Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules
From MaRDI portal
Recommendations
- Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method
- A numerical model for heat sinks with phase change materials and thermal conductivity enhancers
- Analysis of microchannel heat sinks for electronics cooling
- Thermal management of high power electronics with phase change cooling
- Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
Cites work
- Conduction trees with spacings at the tips
- Constructal optimization of nonuniformly distributed tree-shaped flow structures for conduction
- Constructural-theory network of conducting paths for cooling a heat generating volume
- scientific article; zbMATH DE number 3917522 (Why is no real title available?)
Cited in
(4)- Unification of electromagnetic and thermal analyses to determine losses and temperature distribution in a slot-embedded conductor
- Analysis of heat transfer in the rapid thermal processing of the plasma display panel
- Numerical study of thermal spreading resistance in body-fitted curvilinear coordinates
- A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures
This page was built for publication: Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q1009813)
